Silica Dispersions for Capillary Underfill
Advanced chip scale packaging formats have created demanding requirements
for capillary underfill materials. Higher CTE materials with exceptional rheological
properties are required to meet industry standards. A key to achieving these
performance levels is the dispersion quality and uniformity of the underfill
material. Five Star delivers a new level of performance to the underfill formulator
through its silica dispersions. Five Star works with formulators to create
and stabilize highly loaded silica dispersions that are extremely uniform in
particle size. This is illustrated below with before and after micrographs
of a silica dispersion in a custom resin.
Highly aggregated clusters of silica in the as-received material limit its
use in demanding underfill applications, yielding high viscosities and inconsistent
CTE. Five Star creates dispersions with lower viscosities at higher silica
loadings, enabling a new standard in underfill reliability and performance.
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