Press Release
Company Contact:
Dana L. Hankey, Ph.D.
Business Director, Electronic Materials
Five Star Technologies
Phone: 805-898-7075
E-mail: dana.l.hankey@worldnet.att.net
October 4 2007
Five Star Technologies Adds Low Firing Conductive Pastes to ElectroSperse™ Line
Cleveland, Ohio. October 4, 2007. Five Star Technologies announced that it has introduced
ElectroSperse™ X-120, X-122 and X-126, silver-based conductor pastes designed for firing at
temperatures as low as 380° C. The new pastes demonstrate excellent adhesion to ITO (Indium Tin Oxide)
or F-doped TO (Fluorine-doped Tin Oxide)-coated glass when fired at 380°-500° C. All three products
maintain excellent conductivity, even at the low end of the firing profile, achieving sheet resistivity
of 2-3 milli-ohms/sq. This exceptional combination of lower firing temperatures and high conductivity
should enable use in electrode applications where other components could be damaged by higher fire profiles.
Such potential applications include ceramic components, display electrodes, heater circuits and antennae.
Like all pastes in the ElectroSperse line, the X-120 series products contain a highly uniform dispersion
of silver with a tightly controlled particle size distribution in the low to sub-micron range. This enables
customers to print fine features with much greater precision and consistency than conventional pastes.
X-126 rheology is tailored for syringe dispensing via extrusion, while X-120 and X-122 are intended
for screen printing applications.
Five Star also offers a line of specialty dispersions that deliver enhanced stability and unparalleled
performance for precious metal processing, chip packaging, ceramic components and thick film pastes.
About Five Star Technologies
Five Star Technologies is a supplier of high-performance powders and dispersions
for use in semiconductor and microelectronic packaging, display and ceramic
component applications. Using its patented Particle Management Technology,
Five Star creates precision dispersions of a wide range of materials (metals,
oxides, nitrides, carbon fibers, etc.) in various organic media. Our products
exhibit unparalleled rheological stability and exceptional particle size
control, enabling our customers to produce materials with next-generation
performance profiles.
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