Chip Packaging
Five Star specialty dispersions combine particle size control, reduced viscosities
at comparable loading levels and exceptional dispersion to allow achievement
of higher loadings of functional filler materials while maintaining proper
dispensability of chip packaging materials. The result includes products with
increased thermal and electrical performance, better CTE matching with the
chip/package and, therefore, improved performance and increased reliability.
Applications
include die attach adhesives and thermal management materials as well as capillary
underfill and solder replacement products. A large variety of basic host polymers
have been utilized to achieve such exceptional results, and additional benefits
have been achieved by size control of the host polymers as well.
Five Star’s
dispersion technology can also be utilized to target specific desired rheological
characteristics for the various applications ranging from precise die attach
deposition requirements to those of free-flowing underfill materials. Dispersions
containing materials such as Ag, boron nitride (BN), silica (SiO2) and zinc
oxide (ZnO) are examples of the types of materials currently employed. An added
benefit of this technology is the ability to incorporate mixtures of the above
materials uniformly without causing segregation during subsequent processing.
This
ability to produce stable, well-dispersed, multi-component mixtures allows
creation of new products with desired benefits not previously attained.
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