Ceramic Components
Mobile electronics continue to drive the demand for miniaturization and increased
functionality per unit volume for next generation electronic packages. This
is also directly related to a continuous increase in both operating frequencies
and signal speed requirements. Five Star Technologies has illustrated that
it can deliver exceptionally consistent materials that will facilitate the
development of a variety of chip components such as multi-layer capacitors
and varistors with enhanced performance resulting from thinner, more uniform
functional layers.
Multi-layer chip components are constructed from the stacking
of metallized thin green tape layers. These are typically tape cast from a
ceramic slip that is composed of an organic binder, the functional dielectric
powder and a variety of additives. Five Star’s dispersion technology
is utilized to prepare the ceramic slip, which may be either an aqueous or
solvent-based system. The resultant slip illustrates a uniform stable rheology
that improves the quality of the green tape. In addition, the functional powders
are extremely well dispersed, a critical factor for systems containing small
percentages of performance-controlling additives.
De-agglomeration of the functional
powders during slip preparation also contributes to the quality of the green
tape surface and allows for casting of thinner uniform layers resulting in
increased functionality per unit volume. Typical slip preparation cycles, including
the de-airing process, require one or more days, while the Five Star dispersion
can typically be prepared in 10-30 minutes with superior quality. This translates
to streamlined manufacturing, increased yields, rapid prototyping of new formulations
and decreased processing times for troubleshooting production issues. The metallizations
(electrode materials) applied to these green sheets prior to stacking and firing
also benefit from the Five Star process, as discussed in the section on metal
powder processing.
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